| プロパティ | 試験方法 | LCP GF30 (Type II) | LCP Unfilled (Type II) |
|---|---|---|---|
| 密度 | ISO 1183 | 1.62 g/cm³ | 1.40 g/cm³ |
| 溶融温度 | ISO 11357 | 280°C | 280°C |
| HDT（1.80 MPa） | ISO 75 | 240–260°C | 190–210°C |
| Tensile Modulus (flow direction) | ISO 527 | 15,000 MPa | 10,000 MPa |
| Tensile Modulus (transverse) | ISO 527 | 5,000 MPa | 3,000 MPa |
| Tensile Strength (flow direction) | ISO 527 | 180 MPa | 180 MPa |
| Tensile Strength @ 200°C | ISO 527 | ~150 MPa | 該当なし |
| 破断伸度 | ISO 527 | 1.5–2.5% | 1.5–3.0% |
| 曲げ弾性率 | ISO 178 | 13,000 MPa | 9,000 MPa |
| Charpy Notched Impact +23°C | ISO 179/1eA | 15–25 kJ/m² | 20–30 kJ/m² |
| CTE (flow direction) | ISO 11359 | 1–3 × 10⁻⁶/°C | 1–5 × 10⁻⁶/°C |
| CTE (transverse) | ISO 11359 | 15–30 × 10⁻⁶/°C | 25–50 × 10⁻⁶/°C |
| Water Absorption (23°C, 24h) | ISO 62 | < 0.05% | < 0.05% |
| Flammability (UL94) | UL94 | V-0 @ 0.2 mm | V-0 @ 0.2 mm |
| 金型収縮率（フロー） | ISO 294-4 | 0.0–0.2% | 0.0–0.3% |
| Mold Shrinkage (transverse) | ISO 294-4 | 0.4–0.7% | 0.5–0.9% |
| Dielectric Constant @ 1 GHz | IEC 60250 | 3.5–4.0 | 3.0–3.5 |
| Dissipation Factor @ 1 GHz | IEC 60250 | 0.005–0.010 | 0.003–0.008 |
LCP vs. PPS vs. PEEK: High-Temperature Thermoplastics Showdown
LCP, PPS, and PEEK are the three most frequently cross-shopped materials in the >200°C thermoplastic space. The table below shows why none of them displaces the others entirely — each material has a performance-cost profile that matches a specific application envelope.
| プロパティ | LCP GF30 | PPS GF40 | PEEK 30% GF |
|---|---|---|---|
| 密度 | 1.62 g/cm³ | 1.65 g/cm³ | 1.49 g/cm³ |
| HDT（1.80 MPa） | 240–260°C (Type II) 300–350°C (Type I) |
265°C | 315°C |
| Continuous Use Temp | 200–240°C (Type II) 260–300°C (Type I) |
200～220°C | 250°C |
| CTE (flow direction) | 1–3 × 10⁻⁶/°C | 15–25 × 10⁻⁶/°C | 15–25 × 10⁻⁶/°C |
| 200°Cにおける引張弾性率 | ~10,000 MPa | 約12,000 MPa | ~8,000 MPa |
| Tensile Strength @ 200°C | ~150 MPa | ~130 MPa | ~120 MPa |
| Impact Toughness @ RT | Low (15–25 kJ/m²) | Moderate (25–40 kJ/m²) | High (50–70 kJ/m²) |
| 可燃性 | V-0 inherent (no additives) | V-0 (with additives) | V-0 (with additives) |
| Water Absorption | < 0.05% | 0.03% | 0.1% |
| 耐薬品性 | Excellent (acids, solvents) | Excellent (nearly universal below 200°C) | Excellent (except strong acids) |
| Weld Line Strength | Poor (inherently weak) | フェア | グッド |
| Wall Thickness Minimum | 0.1 mm | 0.3 mm | 0.5 mm |
| Processing Temp | 300–350°C | 320～340°C | 380–400°C |
| Mold Temp | 80～120°C | 130–150°C | 170–200°C |
| Relative Cost / kg | $$$ | $$ | $$$$ |
| 最適 | Ultra-thin-wall electronics, CTE-critical, SMT | Chemical plant, hot water, structural | Maximum toughness, medical implants, structural aerospace |
Decision Rules
- Choose LCP when: You need CTE near steel (1–3 ppm/°C), walls thinner than 0.3 mm, or inherent V-0 without property trade-offs. Electronics connectors, SIM trays, and 5G antenna substrates are LCP’s home turf.
- Choose PPS when: Chemical resistance is paramount (especially hot water, steam, or aggressive acids at 150°C+), you need better toughness than LCP, and CTE is less critical. PPS is also roughly 30–40% cheaper per kilogram than LCP.
- Choose PEEK when: Toughness is non-negotiable, continuous use approaches 250°C, or biocompatibility is required. PEEK is the only option in this group for load-bearing medical implants, and it tolerates steam sterilization better than either LCP or PPS.
LCP Commercial Grade Selector
| 製造元 | ブランド | グレード | GF % | タイプ | 主な特徴 | 代表的な用途 |
|---|---|---|---|---|---|---|
| セラニーズ | Vectra | A130 | 30% | II | General-purpose GF30, standard flow | Connectors, bobbins, coil forms |
| セラニーズ | Vectra | E130i | 30% | II | Improved weld-line strength, higher toughness | Complex connector geometries |
| セラニーズ | Vectra | A150 | 50% | II | Maximum stiffness, lowest shrinkage | High-rigidity structural electronics |
| セラニーズ | Vectra | A230 | 30% carbon fiber | II | Conductive, high stiffness | ESD-sensitive electronics |
| セラニーズ | Vectra | E820i Pd | 40% (GF+mineral) | II | Platable grade, LDS-compatible | 3D-MID circuits, antenna substrates |
| セラニーズ | Vectra | E830i Pd | 30% GF | II | Platable, FDA compliant | Medical device housings |
| セラニーズ | Zenite | 6130L | 30% | II | Low warp, balanced flow | SMT connectors, DDR sockets |
| セラニーズ | Zenite | 6145L | 45% | II | Low warp, high stiffness | Long, thin connectors |
| ポリプラスチックス | Laperos | A130 | 30% | II | 標準型 GF30、高流量 | Consumer electronics |
| ソルベイ | Xydar | G-930 | 30% | I | Type I GF30 — 300°C+ HDT | Oven components, aerospace connectors |
| ソルベイ | Xydar | G-945 | 45% | I | Type I max stiffness | High-temp structural |
| Sumitomo | SUMIKASUPER | E6000 | 30% | II | Ultra-low dielectric for 5G | 5G antenna substrates, mmWave |
| Toray | Siveras | LX70G30 | 30% | II | Improved toughness GF30 | USB-C connectors, camera modules |
Processing LCP: Injection Molding Parameters
| パラメータ | 推奨値 | 備考 |
|---|---|---|
| 予備乾燥 | 140–160°C for 4 hours | 乾燥剤式乾燥機が必要です。目標水分率 < 0.01% |
| 溶融温度 | 300–350°C | Type II grades; Type I requires 350–400°C |
| 金型温度 | 80～120°C | Lower than PPA or PEEK — water-heated molds often sufficient |
| 射出速度 | 速い | LCP solidifies rapidly — fill speed is critical for thin walls |
| 加圧状態の維持 | 40–60 MPa | LCP shrinkage is near-zero in flow direction; pack lightly |
| 滞留時間 | Minimize (≤ 10 min) | LCP is thermally stable but extended residence reduces properties |
Critical processing insights:
- Weld lines are the Achilles’ heel: LCP’s highly oriented molecular structure creates inherently weak weld lines — strength at a weld line can be 30–50% of the bulk value. Gate placement is more consequential for LCP than for any other engineering thermoplastic. When possible, design parts to avoid weld lines in load-bearing regions, or use multi-gate sequential valve gating to knit fronts under pressure.
- Drying is mandatory: Although LCP absorbs almost no water at room temperature, any surface moisture on pellets hydrolyzes the polymer at 330°C. The 0.01% moisture target is stricter than for most engineering polymers.
- Anisotropy is designed-in: LCP’s mechanical properties are inherently anisotropic — strong in the flow direction, weaker transversely. Part design must account for this. Where isotropy is needed, consider mineral-filled or specialty grades, but expect a stiffness penalty.
- Low shrinkage, high precision: Near-zero shrinkage in the flow direction means LCP molds can hold extraordinarily tight tolerances — but this also means the mold cavity must be cut to essentially final dimensions. No “sizing factor” allowance like with polyolefins.
- Fast cycle times: LCP solidifies almost instantly upon contacting the mold wall. Cycle times of 2–5 seconds for small electronic connectors are routine — this is LCP’s single greatest processing advantage.
Key LCP Applications
| 産業 | 用途 | Driving Property |
|---|---|---|
| コンシューマー・エレクトロニクス | SIM card trays, USB-C connectors, DDR memory sockets, camera module housings | Thin-wall (0.1–0.3 mm), V-0, survives reflow, CTE match to copper |
| 5G / Telecommunications | Antenna substrates, mmWave lens arrays, base station connector bodies | Low Dk/Df at GHz frequencies, dimensional stability |
| 自動車 | Ignition coil bobbins, transmission speed sensors, relay bases | Heat resistance, oil resistance, electrical insulation |
| メディカル | Surgical instrument handles, dental tool bodies, catheter components | Steam sterilizable, chemical resistance, dimensional precision |
| Fiber Optics | Optical fiber connectors (MT, MPO ferrules), alignment sleeves | CTE match to glass fiber, micromolding precision |
| 航空宇宙 | High-temperature connector inserts, waveguide components, radome structures | Type I grades: 300°C+ service, low outgassing, lightweight |
| インダストリアル | Pump wear rings, chemical valve seats, bearing cages (high-temp) | Chemical resistance at 150°C+, dimensional stability in aggressive media |
LCP Limitations
- Weld line weakness: This cannot be overstated. If your part has converging melt fronts in a stressed area, LCP is probably not the right material. Weld line strength in LCP is worse than PPS, far worse than PA66.
- Low impact toughness: Unfilled and GF LCP grades are inherently brittle. Charpy notched values of 15–25 kJ/m² make them unsuitable for snap-fit applications or parts subject to impact loads.
- Anisotropic properties: Tensile modulus can vary 3:1 between the flow direction and transverse direction. This is manageable when the mold designer knows it, but problematic if the part was designed for an isotropic material.
- Cost: LCP costs 3–6× a standard PA66 GF30 and roughly 2× PPS GF40. You are paying for the unique combination of CTE, thin-wall capability, and inherent V-0.
- Limited colorability: LCP is typically black or natural. Light colors are difficult due to the high processing temperatures.
- Notch sensitivity: LCP’s sharp notches propagate cracks readily. Avoid sharp internal corners in part design.
What Is LCP?
LCP (Liquid Crystal Polymer) occupies a unique position in the engineering polymers hierarchy. It is not a nylon, not a polyester in the conventional sense, and not a filled compound — LCP is a wholly aromatic polyester that forms ordered, rod-like molecular structures in the melt state. When LCP flows into a mold, those rigid molecular rods align along the flow direction, giving the molded part an effect analogous to self-reinforcement: tensile modulus and strength along the flow axis far exceed what the resin’s density and composition suggest.
The practical result: HDT values exceeding 300°C, thermal expansion coefficients comparable to steel (1–3 × 10⁻⁶/°C), wall-thickness capability down to 0.1 mm, and inherent UL94 V-0 flammability without additive loading. No other thermoplastic combines this set of properties at LCP’s price point.
For engineers and buyers searching for LCP datasheets, Vectra vs Zenite grade comparisons, LCP vs PPS vs PEEK selection guidance, or LCP thin-wall molding parameters, this page consolidates the key specifications, grades, processing windows, and application data.
LCP Type Classification: I, II, III
The LCP family is divided into three types based on heat deflection temperature (HDT), which is driven by the monomer chemistry and resulting backbone rigidity.
| タイプ | HDT Range (°C) | Base Chemistry | Example Brand | 主な特徴 | Typical Use |
|---|---|---|---|---|---|
| Type I | 250–350 | Para-hydroxybenzoic acid + biphenol + terephthalic acid | Xydar (Solvay), Ekonol | Highest heat resistance, can survive 300°C+ continuous | Ovenware, aerospace, high-temp connectors |
| Type II | 180–240 | Para-hydroxybenzoic acid + 6-hydroxy-2-naphthoic acid | Vectra (Celanese), Zenite (Celanese) | Best balance of processability, properties, and cost | Electronics connectors, SMT, 5G components |
| Type III | 60–210 | Ethylene terephthalate + para-hydroxybenzoic acid | X7G, Rodrun | Lowest cost, lowest heat — used where flow matters more than T | Thin-wall consumer goods, fibers |
In practice, Type II (Vectra/Zenite) dominates commercial injection molding — roughly 80% of LCP consumption falls here. Type I is reserved for the highest-temperature applications where cost is secondary. Type III has largely been displaced by Type II as processors gained experience with the higher-temperature grades.
LCP GF30 Typical Properties
よくあるご質問
What does LCP stand for in plastics?
LCP stands for Liquid Crystal Polymer. The name comes from the material’s unique behavior: even in the molten state, LCP molecules maintain a degree of orientational order (a “liquid crystalline” phase), unlike conventional polymers whose molecules are randomly coiled when melted. This liquid-crystalline melt structure is what gives LCP its extreme flowability, self-reinforcing properties, and low thermal expansion.
What is the difference between LCP Type I, II, and III?
The three types are distinguished by heat deflection temperature (HDT): Type I (250–350°C, e.g., Xydar) for the highest-temperature applications like aerospace; Type II (180–240°C, e.g., Vectra, Zenite) for general-purpose electronics and automotive, which represents the majority of commercial LCP consumption; and Type III (60–210°C, e.g., X7G) which is a lower-cost variant now mostly displaced by Type II.
Is LCP better than PEEK?
“Better” depends on the requirement. LCP has higher flow-direction stiffness at 200°C, lower CTE (1–3 vs. 15–25 ppm/°C), faster cycle times (2–5 seconds vs. 30+ seconds), and lower per-kilogram cost than PEEK. PEEK has dramatically better impact toughness (50–70 vs. 15–25 kJ/m²), higher continuous-use temperature (250°C vs. 200–240°C), and weld line strength far exceeding LCP. If your part has converging melt fronts under load, choose PEEK. If it’s a thin-wall electronic connector needing CTE match and V-0, LCP wins.
Can LCP replace metal?
In specific applications, yes. LCP’s CTE of 1–3 × 10⁻⁶/°C matches steel and copper better than any other unfilled thermoplastic. This is why LCP has replaced metal in SIM card trays, camera module housings, and optical fiber ferrules — the part maintains dimensional compatibility with metal and glass components across assembly and operating temperatures.
Does LCP absorb water?
No — and this is one of LCP’s defining advantages. Water absorption is below 0.05%, meaning LCP parts neither swell in humid environments nor require conditioning before use. Combined with its near-zero flow-direction mold shrinkage, this makes LCP the go-to material for parts that must arrive at assembly with tight tolerances regardless of shipping or storage humidity.
What is the maximum temperature for LCP?
Type II LCP (Vectra/Zenite) has a continuous-use rating of 200–240°C, with short-term excursions to 260°C for lead-free reflow soldering. Type I LCP (Xydar) can sustain 260–300°C continuous. The melting point for Type II is approximately 280°C; for Type I it exceeds 350°C.
Need LCP pellets, Vectra or Zenite datasheets, or help selecting the right LCP grade? We supply GF-carbon, platable, and low-warp LCP grades from Celanese, Polyplastics, and Sumitomo. Contact us with your part geometry, temperature, and electrical requirements.
よくある質問
LCPは他のエンジニアリングプラスチックと何が違うのでしょうか？
液晶ポリマー（LCP）は、成形時に自己補強作用を発揮する独自の剛性ロッド状分子構造を持ち、流動方向の物性が一部の金属に匹敵するレベルに達します。また、極めて高い耐薬品性を備え、吸湿率はほぼゼロです（<0.03%), and exceptional thin-wall flowability — enabling wall sections as thin as 0.2mm.
電子機器分野において、LCPの主な用途は何ですか？
LCPは、高周波コネクタ（5G、USB-C）、ファインピッチSMTコネクタ、リレー部品、およびスマートフォンの内部構造部品において、主流の材料となっています。その低い誘電率（3.0～3.5）とGHz帯域における低い損失係数により、高速信号の信号整合性を確保するのに最適です。.
Vectra LCPとZenite LCPを比較するとどうでしょうか？
Vectra（Celanese社）とZenite（DuPont社／Celanese社）は、いずれも熱トロピック型LCPの製品群です。Vectra Aシリーズは、HDTが約280°Cの汎用グレードです。 ゼナイトの各グレードは、複雑なマルチゲート金型において、ウェルドライン強度の向上や流動性の改善を図るよう配合されていることが多い。両者とも基本的な特性は類似しているが、グレードごとに特長とトレードオフがある。.
LCPは医療用途に使用できますか？
はい、特定のLCPグレードは、患者との短期接触に関するUSPクラスVIおよびISO 10993の生体適合性要件を満たしています。これらは、手術器具、薬剤送達デバイスの構成部品、および歯科用器具に使用されています。LCPは、劣化することなく繰り返しのオートクレーブ滅菌に耐えることができるという特性があり、これが他の多くのポリマーに比べて大きな利点となっています。.
Last updated: June 2026. Datasheet values are typical. Always verify specific grade properties with the manufacturer’s current technical data sheet. Vectra and Zenite are registered trademarks of Celanese. Xydar is a registered trademark of Solvay. PEEK is a registered trademark of Victrex. PPS is sold under various trademarks including Ryton (Solvay) and Fortron (Celanese).
